Printed circuit board having embedded capacitors using...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C029S025410, C029S025420, C361S321200, C361S321300

Reexamination Certificate

active

11361078

ABSTRACT:
The present invention is related to a printed circuit board having embedded capacitors using a hybrid material and a method of manufacturing the same. This invention provides a printed circuit board having embedded capacitors using a material for a hybrid dielectric layer including liquid crystal polymer and ceramic powder, and a method of manufacturing such a printed circuit board.

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patent: 2003/0072129 (2003-04-01), Kuwako et al.
patent: 10-2004-0041088 (2004-05-01), None

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