Printed circuit board having electromagnetic bandgap structure

Details Printed circuit board having electromagnetic bandgap structure Printed circuit board having electromagnetic bandgap structure

2011-05-17

2011-05-17

Semenenko, Yuriy (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000, C174S262000, C361S760000

Reexamination Certificate

active

07943864

ABSTRACT:
In accordance with an embodiment, the printed circuit board, having an analog circuit and a digital circuit includes: a first metal layer and a second metal layer, one of the first metal layer and the second metal layer being a power layer and the other being a ground layer; a third metal layer, layer-built between the first metal layer and the second metal layer; and a mushroom type structure including a via connected to a metal plate, the metal plate being arranged in a space between circuit patterns of the third metal layer.

REFERENCES:
patent: 5592391 (1997-01-01), Muyshondt et al.
patent: 6476771 (2002-11-01), McKinzie, III
patent: 6787895 (2004-09-01), Jarcy et al.
patent: 7764149 (2010-07-01), Han et al.
patent: 2005/0029632 (2005-02-01), McKinzie et al.
patent: 2005/0205292 (2005-09-01), Rogers et al.
patent: 2007/0090398 (2007-04-01), McKinzie, III et al.
patent: 2010/0108373 (2010-05-01), Park
patent: 2002-289990 (2002-10-01), None
patent: 2006-302986 (2006-11-01), None
Japanese Office Action issued Sep. 21, 2010 in corresponding Japanese Patent Application 2008-162568.

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