Printed circuit board having axially parallel via holes

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Details

C174S260000, C174S261000, C174S263000, C174S264000, C174S265000, C174S266000, C361S792000, C361S794000, C361S795000

Reexamination Certificate

active

07408120

ABSTRACT:
Disclosed is a PCB having axially parallel via holes, in which an outer ground via hole, acting as a ground, is formed around a via hole for intercircuit connection in the PCB, thereby minimizing the effect of noise caused by the via hole.

REFERENCES:
patent: 5140110 (1992-08-01), Nakagawa et al.
patent: 5374788 (1994-12-01), Endoh et al.
patent: 5623160 (1997-04-01), Liberkowski
patent: 5949030 (1999-09-01), Fasano et al.
patent: 6479764 (2002-11-01), Frana et al.
patent: 6486414 (2002-11-01), Kobayashi et al.
patent: 7154047 (2006-12-01), Howard
patent: 2002/0179332 (2002-12-01), Uematsu et al.
patent: 2003/0102124 (2003-06-01), Vinegar et al.
patent: 2005/0247482 (2005-11-01), Nakamura
patent: 2001-244635 (2001-09-01), None
patent: 2002-353588 (2002-12-01), None

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