Printed circuit board having an integrated decoupling capacitive

Details Printed circuit board having an integrated decoupling capacitive Printed circuit board having an integrated decoupling capacitive

1991-08-27

1992-11-10

Griffin, Donald A.

Electricity: electrical systems and devices

Miscellaneous

428209, 174 685, H05K 103, H05K 118, B32B 900

Patent

active

051629771

ABSTRACT:
A printed circuit board is disclosed which includes a high capacitance power distribution core, the manufacture of which is compatible with standard printed circuit board assembly technology. The high capacitance core consists of a ground plane and a power plane separated by a planar element having a high dielectric constant. The high dielectric constant material is typically glass fiber impregnated with a bonding material, such as epoxy resin loaded with a ferro-electric ceramic substance having a high dielectric constant. The ferro-electric ceramic substance is typically a nanopowder combined with an epoxy bonding material. The resulting capacitance of the power distribution core is typically sufficient to totally eliminate the need for decoupling capacitors on a typical printed circuit board.

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patent: 5010641 (1991-04-01), Sisler
"Properties of Very Thin Sol-Gel Ferroelectrics", Sanchez et al., Proceedings of the Second Symposium on Integrated Ferroelectrics, Ferroelectrics, vol. 116, pp. 1-17, Gordon and Breach Science Publishers, 1991.
"Eliminating Capacitors From Multilayer PCBs", Sisler, Printed Circuit Design, Jul. 1991.

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