Printed circuit board having a well structure accommodating one

Details Printed circuit board having a well structure accommodating one Printed circuit board having a well structure accommodating one

1997-08-25

2000-03-28

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361761, 361764, 257724, H05K 118

Patent

active

060439874

ABSTRACT:
Printed Circuit Board fabrication costs are decreased, and device placement densities are increased by the use of well structures designed for receiving components such as capacitors on portions of the PCB directly beneath integrated circuit packages having very low vertical profiles. With such an arrangement it is possible to use newer low profile packages and still place a capacitor under the integrated circuit package for reduced area consumption and improved inductance and circuit cycle times. Further advantages of the present arrangement include a reduction in the number of vias that need to be drilled in the PCB to make capacitor attachments, a consequent improvement in PCB inductance and parasitic capacitance, and improved electrical properties for voltage reference planes and routing layers.

REFERENCES:
patent: 4964019 (1990-10-01), Belanger, Jr.
patent: 5780776 (1998-07-01), Noda
patent: 5831833 (1998-11-01), Shirakawa et al.

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