Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-09-18
2000-03-28
Thompson, Gregory
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174252, H05K 720
Patent
active
060439866
ABSTRACT:
A printed circuit board, having a plurality of via-holes provided in an area where circuit elements are arranged, includes a thermally conductive material having thermally good conductivity, for example copper, and the thermally good conductive material is formed in an inner wall of each of the plurality of via-holes. Each of the plurality of via-holes has, for example, a circular shape, and is arranged in the form of hexagonal or triangular lattice in the area where the circuit elements are arranged. Further, preferably, a diameter of each of the plurality of via-holes is equal to a hole pitch having an allowance .+-.0.3 mm. According to above structure, it is possible to provide a plurality of via-holes per unit area with high density on the printed circuit board and to improve the thermal conductivity of the printed circuit board by effectively radiating the heat generated from the circuit elements.
REFERENCES:
patent: 4689442 (1987-08-01), Ozatti
patent: 5113315 (1992-05-01), Li et al.
patent: 5258887 (1993-11-01), Fortune
patent: 5513070 (1996-04-01), Xie et al.
Kabune Hideki
Kondo Koji
Kumabe Hajime
Nakakuki Kiyoshi
Nippondenso Co. Ltd.
Thompson Gregory
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