Printed circuit board having a plurality of via-holes

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

174252, H05K 720

Patent

active

060439866

ABSTRACT:
A printed circuit board, having a plurality of via-holes provided in an area where circuit elements are arranged, includes a thermally conductive material having thermally good conductivity, for example copper, and the thermally good conductive material is formed in an inner wall of each of the plurality of via-holes. Each of the plurality of via-holes has, for example, a circular shape, and is arranged in the form of hexagonal or triangular lattice in the area where the circuit elements are arranged. Further, preferably, a diameter of each of the plurality of via-holes is equal to a hole pitch having an allowance .+-.0.3 mm. According to above structure, it is possible to provide a plurality of via-holes per unit area with high density on the printed circuit board and to improve the thermal conductivity of the printed circuit board by effectively radiating the heat generated from the circuit elements.

REFERENCES:
patent: 4689442 (1987-08-01), Ozatti
patent: 5113315 (1992-05-01), Li et al.
patent: 5258887 (1993-11-01), Fortune
patent: 5513070 (1996-04-01), Xie et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Printed circuit board having a plurality of via-holes does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printed circuit board having a plurality of via-holes, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit board having a plurality of via-holes will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1331550

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.