Printed circuit board having a commonized mounting pad which dif

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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174261, 174263, 22818021, 22818022, 257778, 361760, 361808, 439 68, 439 83, H05K 702

Patent

active

053031229

ABSTRACT:
The present invention provides a printed circuit board having a unique commonized pad upon which different sized surface mounted devices can be mounted. The preferred form of the commonized pad comprises two electrically conductive pads, each having a tapered portion that electrically connects a narrow portion to a wide portion. The present invention is advantageous over known pads in that it (1) allows for using different sizes of surface mounted devices without redesign and (2) it does not require wasting what might otherwise be antiquated inventory or continuation of an old process to use up what would be antiquated inventory.

REFERENCES:
patent: 4130722 (1978-12-01), Levijoki
patent: 4509096 (1985-04-01), Baldwin et al.
patent: 4605987 (1986-08-01), Allensworth
patent: 4645114 (1987-02-01), Van Den Brekel et al.
patent: 4870225 (1989-09-01), Anao et al.
IBM Technical Disclosure Bulletin "Electrode Pattern" by Milliken et al. vol. 11, No. 7, Dec. 1968.
IBM Technical Disclosure Bulletin "Flip-Chip Joining Physical Land Restriction" by R. H. Massey vol. 12, No. 1, Jun. 1969.

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