Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1994-01-18
1996-01-30
Sparks, Donald A.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174260, 174261, 333165, 333181, 333185, 361777, 361782, 361792, 361795, H05K 111, H05K 706, H03H 700
Patent
active
054885400
ABSTRACT:
A multi-layered printed circuit board is provided. This printed circuit board includes generally a substrate formed with first and second base layers, a first conductive pattern block formed on a surface of the first base layer of the substrate to connect with a power terminal of an IC mounted on an opposite surface of the first base layer, a second conductive pattern block formed on the second base layer to connect with a grounding terminals of the IC, a power conductor arranged in the same plane as the first conductive pattern blocks at a preselected interval therebetween, a grounding conductor arranged in the same plane as the second conductive pattern blocks at a preselected interval therebetween, a first EMI filter provided adjacent the IC in connection with the first conductive pattern block for reducing noise concentrated on the first conductive pattern block, and a second EMI filter provided adjacent the IC in connection with the second conductive pattern block for reducing noise concentrated on the second conductive pattern block.
REFERENCES:
patent: 4954929 (1990-09-01), Baran
patent: 4973799 (1990-11-01), Soma et al.
patent: 5023753 (1991-06-01), Abe
patent: 5068631 (1991-11-01), Vince
Nippondenso Co. Ltd.
Sparks Donald A.
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