Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-06-11
1999-08-24
Sparks, Donald
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174260, 174261, 361760, 361772, 361774, H05K 103, H05K 111, H05K 702, H05K 706
Patent
active
059432179
ABSTRACT:
A printed circuit board is provided to which a device such as a tape carrier package having a multiplicity of leads arranged with a small pitch is connected by a local heating method using a bonding tool. The upper surfaces of solder layers provided on lands formed on the printed circuit board are flattened prior to leads of an electronic part to be mounted being placed on the solder layers. The leads are soldered to the lands by being pressed and heated with the bonding tool. At least a region of the printed circuit board corresponding to the bottom surface of the bonding tool has a height lower than that of the leads superposed on the lands, so that the desired parallelism of the bottom surface of the bonding tool with respect to the printed circuit board is maintained.
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Seiko Epson Corporation
Sparks Donald
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