Printed circuit board for mitigating thermally-induced mechanica

Details Printed circuit board for mitigating thermally-induced mechanica Printed circuit board for mitigating thermally-induced mechanica

1997-10-22

1999-11-16

Sough, Hyung-Sub

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174254, 361749, H05K 100

Patent

active

059862173

ABSTRACT:
A printed circuit board for minimizing thermally-induced mechanical damage of solder joints electrically connecting electronic components to the printed circuit board. The printed circuit board includes a first substrate, solder pads, and an expansion layer. The first substrate has two substantially parallel major surfaces, and a first coefficient of thermal expansion (CTE). The solder pads are located on one of the major surfaces of the substrate. The expansion layer has a second CTE, different than the first CTE, and is affixed to a portion of one of the major surfaces. The expansion layer is also arranged to provide a predetermined degree of bending for a given temperature change to a portion of the first substrate proximate to the expansion layer and to two of the solder pads, thus forming a concavity in the portion of the substrate.

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