Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-07-10
2007-07-10
Dinh, Tuan (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S793000, C361S794000, C361S795000, C361S790000, C174S036000, C174S262000, C174S263000, C174S264000, C174S265000, C174S266000, C174S255000, C439S607560
Reexamination Certificate
active
10603048
ABSTRACT:
In the preferred embodiment, there is disclosed a printed circuit board having a surface providing a mating interface to which is electrically connected an electrical connector having signal conductors and ground conductors. The printed circuit board includes a plurality of stacked dielectric layers, with a conductor disposed on at least one of the plurality of dielectric layers. The mating interface includes a plurality of conductive vias aligned in a plurality of rows, with the plurality of conductive vias extending through at least a portion of the plurality of dielectric layers, at least one of the plurality of conductive vias intersecting the conductor. The plurality of conductive vias includes signal conductor connecting conductive vias and ground conductor connecting conductive vias. For each of the plurality of rows of the conductive vias, there are at least twice as many ground conductor connecting conductive vias as signal conductor connecting conductive vias and the conductive vias are positioned relative to one another so that for each signal conductor connecting conductive via, there are ground conductor connecting conductive vias adjacent either side of the signal conductor connecting conductive via.
REFERENCES:
patent: 4859806 (1989-08-01), Smith
patent: 5331514 (1994-07-01), Kuroda
patent: 5590030 (1996-12-01), Kametani et al.
patent: 5784262 (1998-07-01), Sherman
patent: 6194668 (2001-02-01), Horiuchi et al.
patent: 6232564 (2001-05-01), Arndt et al.
patent: 6293827 (2001-09-01), Stokoe
patent: 6384341 (2002-05-01), Rothermel et al.
patent: 6530790 (2003-03-01), McNamara et al.
patent: 6537087 (2003-03-01), McNamara et al.
patent: 6609933 (2003-08-01), Yamasaki
patent: 6787710 (2004-09-01), Uematsu et al.
patent: 6815621 (2004-11-01), Park et al.
patent: 2003/0091730 (2003-05-01), Jessep et al.
patent: 03/043138 (2003-05-01), None
Gailus Mark W.
Khilchenko Leon M.
Payne Jason J.
Ren Huilin
Amphenol Corporation
Blank Rome LLP
Dinh Tuan
Nguyen Hoa C.
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