Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent
1996-09-13
1998-01-13
Lam, Cathy F.
Stock material or miscellaneous articles
Structurally defined web or sheet
Discontinuous or differential coating, impregnation or bond
428901, 361679, 361743, 361767, 361808, 174250, 174261, B32B 300, H05K 500, H05K 114, H05K 710
Patent
active
057077142
ABSTRACT:
An improved printed circuit board which can reduce or eliminate unsatisfactory soldering caused by trapped gas in surface mounting electronic components by flow soldering is disclosed. According to the invention, the printed circuit board comprises an electrically conductive pattern having a plurality of connection pads to which leads of electronic components are to be connected; and a solder resist layer formed over said electrically conductive pattern and having a plurality of windows which expose said connection pads, wherein at least one of said windows has an extension exposing an additional part of said pad, said extension being substantially narrower than said window. The extension allows the additionally exposed part of the pad to contact with the solder even when the associated pad is almost entirely covered by the trapped gas, so that the solder is pulled to the pad and spread over the pad. Because the extension require a small area, it is effective even when the components are mounted at a high density.
REFERENCES:
patent: 5256464 (1993-10-01), Hecht
patent: 5453882 (1995-09-01), Amano et al.
patent: 5493075 (1996-02-01), Chong et al.
patent: 5541367 (1996-07-01), Swamy
Furutatsu Tetsuya
Nagase Yuichi
Shioiri Seiji
Lam Cathy F.
Mitsuba Corporation
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