Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1999-09-13
2002-04-09
Gaffin, Jeffrey (Department: 2845)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S814000, C361S818000, C174S256000
Reexamination Certificate
active
06370034
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a printed circuit board for electrical devices having RF components, particularly for mobile radio telecommunication devices, wherein the printed circuit board has a “micro via” coating applied to it and includes RF circuits, non-RF circuits, RF conductor-track structures and non-RF conductor-track structures arranged on it.
2. Description of the Prior Art
In electrical devices having radio-frequency components or radio-frequency device parts (RF component; RF device parts), these RF components need [lacuna] to be separated from the non-RF components (e.g. AF components) or protected against reciprocal influences, on account of interreactions which arise between such components. This may occur because (1) the RF signals affect the AF response of the AF components if the latter are a placed too close to the RF components; (2) or when the AF components are placed too close to the RF components, the RF parameter settings of the RF components are affected. A typical location where RF components (RF circuits with RF interconnections and RF components) and non-RF components (non-RF circuits with non-RF interconnections and non-RF components) are arranged in close proximity to one another is a printed circuit board or electronic printed circuit board assembly in electrical devices. Furthermore, the interfering interaction between the components is accentuated in small electrical devices with small printed circuit boards. On the other hand, the demand for ever smaller and more compact electrical devices is increasing. This is particularly; the case where the miniaturized devices are portable i.e., the user can take them virtually anywhere (to any geographical location). One example of such small portable devices is mobile radio communication devices.
On the basis of the multiplicity of mobile radio telecommunication devices ( such as DECT telecommunication devices, GSM telecommunication devices, PHS telecommunication devices, “IS-95” telecommunication devices and other telecommunication devices based on pure or hybrid transmission methods from the basic transmission methods FDMA, TDMA, CDMA (e.g., the DS-CDMA method or the JD-CDMA method) which are used for a variety of message transmission purposes (such as the transmission of speech, packet and/or video data) and which give rise, by way of example, to the problems illustrated above relating to “demand for miniaturization on the one hand and avoidance of the interfering interaction between RF components and AF components on the other” in the context of the demand for cheaper and cheaper devices (i.e., mass-produced product), the following gives a representative illustration and explanation, for all the devices mentioned, of the effects produced thereby, using the example of a DECT mobile part.
FIG. 1
shows a first printed circuit board LP
1
, which is used in the Siemens “GIGASET 1000 S,C” DECT mobile part and, for production engineering reasons, is preferably fitted with components on one side. As shown in the cross section illustration in
FIG. 2
, the printed circuit board LP
1
has a multilayer first printed circuit board assembly LPT
1
which includes four printed circuit board layers LPL
1
. . . LPL
4
, has a thickness of approx. 1350 &mgr;m, and is preferably constructed using the known hybrid masslam process. The printed circuit board assembly LPT
1
referred to here contains a first core K
1
having a thickness of approx. 360 m, and having with a first metal coating M
1
K1
(third printed circuit board layer LPL
3
) which is arranged on the underside of the core K
1
, is preferably made of copper. The first core K
1
also has a second metal coating M
2
K1
(second printed circuit board layer LPL
2
) which is arranged on the top of the core K
1
and is preferably made of copper. The metal coatings M
1
K1
, M
2
K1
have a respective first “prepreg” coating P
1
, with a thickness of in each case approx. 360 &mgr;m, arranged on them. The “prepreg” coatings denoted are glass fiber reinforced epoxy coatings. The “prepreg” coating PI arranged on the metal coating M
1
K1
has, on the side opposite the metal coating M
1
K1
, a third metal coating M
1
P1
(fourth printed circuit board layer LPL
4
) which is preferably made of copper and, on the side opposite the metal coating M
2
K1
, a fourth metal coating M
2
P1
(first printed circuit board layer LPL
1
) which also is preferably made of copper. The first printed circuit board layer LPL
1
has a critical first RF conductor-track structure LBS
1
RF
, for example, arranged in it, whilst the second printed circuit board layer LPL
2
is provided with a first non-RF conductortrack structure LBS
1
NRF
and/or a first non-RF circuit interconnection SVD
1
NRF
, for example. To protect the RF conductor-track structure LBSL
1
RF
in relation to the RF ground coating MS
RF
in the third printed circuit board layer LPL
3
from the influence of the non-RF conductor-track structure LBS
1
NRF
and/or a first non-RF circuit interconnection SVD
1
NRF
, the second printed circuit board layer LPL
2
is provided with a first barrier area SB
1
which largely surrounds first field lines FL
1
of the RF signal. Furthermore, the printed circuit board assembly LPT
1
has first through holes DB
1
LPT1
for RF connections and non-RF connections between the first printed circuit board layer LPL
1
and the fourth printed circuit board layer LPL
4
, as well as second through holes DB
2
LPT1
for connecting external modules (e.g. earpiece, microphone etc.).
FIG. 3
shows an enlarged three-dimensional illustration of the region drawn in dashed lines in FIG.
2
.
FIG. 4
shows a second printed circuit board LP
2
, used in the Siemens “GIGASET 2000 S,C” DECT mobile part and again, for production engineering reasons, preferably fitted with components on one side. As shown in the cross section illustration in
FIG. 5
, the printed circuit board LP
2
has a multilayer second printed circuit board assembly LPT
2
, which again includes the four printed circuit board layers LPL
1
. . . LPL
4
, has a thickness of approx. 1350 &mgr;m, and is preferably constructed using the known hybrid masslam process. The printed circuit board assembly LPT
2
referred to here contains a second core K
2
having a thickness of approx. 360 &mgr;m and having a fifth metal coating M
1
K2
(third printed circuit board layer LPL
3
) which is arranged on the underside of the core K
2
and is preferably made of copper.
The second core K
2
also has a sixth metal coating M
2
K2
(second printed circuit board layer LPL
2
) which is arranged on the top of the core K
2
, is preferably made of copper, and forms the second RF ground coating MS
2
RF
. The metal coating M
1
K2
, M
2
K2
has a respective second “prepreg” coating P
2
, with a thickness of in each case approx. 360 &mgr;m, arranged on it. The “prepreg” coating P
2
arranged on the metal coating M
1
K2
has, on the side opposite the metal coating M
1
K2
, a seventh metal coating M
2
P2
(fourth printed circuit board layer LPL
4
) which is preferably made of copper and, on the side opposite the metal coating M
2
K2
, an eighth metal coating M
2
P2
(first printed circuit board layer LPL
1
), preferably made of copper. The printed circuit board layers LPL
2
. . . LPL
4
have a known tri-plate structure arranged in them. This structure includes a critical second RF conductor-track structure LBS
2
RF
in the third printed circuit board layer LPL
3
, the RF ground coating MS
2
RF
in the second printed circuit board layer LPL
2
, and a third RF ground coating MS
3
RF
, which is amply designed for second field lines FL
2
of the RF signal, in the fourth printed circuit board layer LPL
4
. Furthermore, the printed circuit board assembly LPT
2
has first through holes DB
1
LPT2
for the RF connections and non-RF connections between the first printed circuit board layer LPL
1
and the fourth printed circuit board layer LPL
4
as well as second through holes DB
2
LPT2
for connecting the external module
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