Printed circuit board for ball grid array semiconductor package

Details Printed circuit board for ball grid array semiconductor package Printed circuit board for ball grid array semiconductor package

1997-06-25

1999-11-09

Kincaid, Kristine

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257787, 361760, H01L 2328

Patent

active

059818735

ABSTRACT:
A printed circuit board for a BGA semiconductor package provided at one corner thereof with a degating opening serving as a mold runner gate during a process of molding a resin seal adapted to protect the semiconductor chip and serving as a region for degating a surplus resin formed after the molding process and a method for molding a BGA semiconductor using the printed circuit board. The degating opening has an inverted triangular shape having curved lateral sides and a vertex, at which the lateral sides join together, disposed in a region for forming the resin seal, or an inverted trapezoidal shape having one end disposed in the resin seal region. The invention can eliminate the peeling or damage of the upper surface of the printed circuit board occurring upon degating a surplus resin, the damage of the printed circuit board due to a torsion thereof, the damage of conductive traces on the printed circuit board, the exposure of the conductive traces caused by the damage of a solder mask, and the damage of a resin seal on the printed circuit board. Therefore, an improvement in productivity and reliability is achieved.

REFERENCES:
patent: 5517056 (1996-05-01), Bigler et al.
patent: 5635671 (1997-06-01), Freyman et al.

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