Printed circuit board for avoiding producing cutting burrs

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Details

C174S262000

Reexamination Certificate

active

07126061

ABSTRACT:
A printed circuit board for avoiding producing burrs, the printed circuit board includes a packaging substrate, at least one plated through hole, at least one first conductive portion, at least one non-conductive portion, at least one second conductive portion and at least one cut section. The plated through hole is formed on the packaging substrate. The first conductive portion and the second conductive portion respectively are adjacent to two sides of a peripheral of the plated through hole and separated by the non-conductive portion. Furthermore, the cut section is arranged on the non-conductive portion, thus the packaging substrate is cut without passing through the first conductive portion, and it will not cause the burrs on the first conductive portion.

REFERENCES:
patent: 6057027 (2000-05-01), Roy
patent: 6263565 (2001-07-01), Gotoh et al.
patent: 6625036 (2003-09-01), Horio
patent: 6798665 (2004-09-01), Kimura
patent: 6998647 (2006-02-01), Morimoto et al.

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