Electrical transmission or interconnection systems – Conductor arrangements or structure
Reexamination Certificate
2006-12-26
2006-12-26
Deberadinis, Robert L. (Department: 2836)
Electrical transmission or interconnection systems
Conductor arrangements or structure
Reexamination Certificate
active
07154196
ABSTRACT:
A printed circuit board having a first switching device (S1or S2), a second switching device (S3or S4), a third switching device (S5or S6), and a common source node (26or166) that are each mounted to a surface of the printed circuit board (50or150). The printed circuit board further includes at least a first set of conductive paths in a first layer, a second set of conductive paths in a second layer, and a plurality of vias that connects the first layer to the second layer. The first set of conductive paths provides electrical conductivity between the common source node, the first switching device, the second switching device, and third switching device. The second set of conductive paths in the second layer provides electrical conductivity between the common source node, the first switching device, and the third switching device. The physical distance between the first low side switching device and the common source node and the distance between the third low side switching device and the common source node is greater than a distance between the second low side switching device and the common source node.
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Repplinger Scott W.
Sparling Larry A.
Wineinger Eugene L.
Cunningham Gary J.
Deberadinis Robert L.
Miller Thomas V.
Motorola Inc.
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