Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2011-07-19
2011-07-19
Patel, T C (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
07980863
ABSTRACT:
In some embodiments, a circuit board interconnect may include one or more of the following features: (a) a first circuit board having a plated through hole within a metal pad on the circuit board, the through hole providing a passage for solder to connect the first circuit board to a second circuit board, (b) a second circuit board having a metal pad able to couple to the first circuit board in an overlapping fashion when solder is passed through the plated through hole, and (c) a non-conductive solder repelling material on a surface of one circuit board.
REFERENCES:
patent: 2731609 (1956-01-01), Sobel, III
patent: 3086189 (1963-04-01), Robbins
patent: 3270251 (1966-08-01), Evans
patent: 3401369 (1968-09-01), Roche et al.
patent: 4250536 (1981-02-01), Barringer et al.
patent: 4526432 (1985-07-01), Cronin et al.
patent: 4533188 (1985-08-01), Miniet
patent: 4618194 (1986-10-01), Kwilos
patent: 4991290 (1991-02-01), MacKay
patent: 5001605 (1991-03-01), Savagian et al.
patent: 5375044 (1994-12-01), Guritz
patent: 5404044 (1995-04-01), Booth et al.
patent: 5440454 (1995-08-01), Hashimoto et al.
patent: 5575554 (1996-11-01), Guritz
patent: 6113248 (2000-09-01), Mistopoulos et al.
patent: 6299337 (2001-10-01), Bachl et al.
patent: 6601292 (2003-08-01), Li et al.
patent: 6729888 (2004-05-01), Imaeda
patent: 6991473 (2006-01-01), Balcome et al.
patent: 7331796 (2008-02-01), Hougham et al.
patent: 7377669 (2008-05-01), Farmer et al.
patent: 7448923 (2008-11-01), Uka
patent: 7665999 (2010-02-01), Hougham et al.
patent: 2003/0193789 (2003-10-01), Karlicek, Jr.
patent: 2003/0223210 (2003-12-01), Chin
patent: 2004/0087190 (2004-05-01), Miyazawa et al.
patent: 2008/0249363 (2008-10-01), Nakamura et al.
patent: 2008/0254653 (2008-10-01), Uka
patent: 2008/0310141 (2008-12-01), Mezouari
patent: 2008/0311771 (2008-12-01), Cho
patent: 2009/0029570 (2009-01-01), Ikeuchi et al.
patent: 2009/0226656 (2009-09-01), Crandell et al.
“Final Office Action mailed Jul. 12, 2010 in co-pending U.S. Appl. No. 12/406,761, “Printed Circuit Board Interconnect Construction,” (6 pages).”
“Non-Final Office Action mailed Apr. 1, 2010 in co-pending U.S. Appl. No. 12/406,761, “Printed Circuit Board Interconnect Construction” (5 pages).”
U.S. Prosecution History of U.S. Appl. No. 12/406,761, Circuit Boards Interconnected By Overlapping Plated Through Holes Portions (214 pgs).
Crandell Wm. Todd
Holec Henry V.
Imas Vladimir
Metrospec Technology, LLC
Patel T C
Pauly, DeVries Smith & Deffner L.L.C.
LandOfFree
Printed circuit board flexible interconnect design does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Printed circuit board flexible interconnect design, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit board flexible interconnect design will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2641378