Printed circuit board fine line plating

Chemistry: electrical and wave energy – Processes and products

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204DIG7, C25D 502

Patent

active

046785450

ABSTRACT:
Printed circuit boards and methods for uniformly electroplating narrow, closely spaced circuitry lines onto such a circuit board substrates are disclosed. The method comprises providing an electroplating tank containing an electroplating solution with at least one anode immersed therein. A conductive metal screen is immersed in and extends across the electroplating solution at a solution spaced apart from such an anodes. A printed circuit board substrate is then placed into the electroplating solution at a position wherein the screen is between the anode and the substrate. Copper is then simultaneously plated onto the printed circuit board substrate at a first voltage and onto the screen at a second voltage when the second voltage is less than the first voltage.

REFERENCES:
patent: 1526644 (1925-02-01), Pinney
patent: 3023154 (1962-02-01), Hough et al.
patent: 3437578 (1969-04-01), Gibbs et al.
patent: 3809642 (1974-05-01), Bond et al.
patent: 3880725 (1975-04-01), Van Raalte et al.
patent: 3954569 (1976-05-01), Vanderveer et al.
patent: 4469564 (1984-09-01), Okinaka et al.
patent: 4507180 (1985-03-01), van der Werf et al.
Circuit World, vol. 11, No. 4, 1985.
"Current-Distribution Improving Aids", Metal Finishing, Mar. 1961, vol. 59, No. 3.
"Electroplating with Improved Layer Thickness Distribution", IBM Technical Disclosure Bulletin, vol. 27, No. 5, Oct. 1984.

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