Chemistry: electrical and wave energy – Processes and products
Patent
1986-06-12
1987-07-07
Tufariello, T. M.
Chemistry: electrical and wave energy
Processes and products
204DIG7, C25D 502
Patent
active
046785450
ABSTRACT:
Printed circuit boards and methods for uniformly electroplating narrow, closely spaced circuitry lines onto such a circuit board substrates are disclosed. The method comprises providing an electroplating tank containing an electroplating solution with at least one anode immersed therein. A conductive metal screen is immersed in and extends across the electroplating solution at a solution spaced apart from such an anodes. A printed circuit board substrate is then placed into the electroplating solution at a position wherein the screen is between the anode and the substrate. Copper is then simultaneously plated onto the printed circuit board substrate at a first voltage and onto the screen at a second voltage when the second voltage is less than the first voltage.
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Circuit World, vol. 11, No. 4, 1985.
"Current-Distribution Improving Aids", Metal Finishing, Mar. 1961, vol. 59, No. 3.
"Electroplating with Improved Layer Thickness Distribution", IBM Technical Disclosure Bulletin, vol. 27, No. 5, Oct. 1984.
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