Printed circuit board, fabrication method and apparatus

Details Printed circuit board, fabrication method and apparatus Printed circuit board, fabrication method and apparatus

2008-08-27

2011-10-11

Semenenko, Yuriy (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C174S262000

Reexamination Certificate

active

08035978

ABSTRACT:
A printed circuit board includes a mounted a first electronic component. The printed circuit board includes a first through holes extending from a mounting surface on which the electronic component is mounted. The printed circuit board includes a second through holes extending from a surface opposite the mounting surface and aligned with the first through holes. A second electronic component may be longitudinally between the first through holes and the second through holes. The first and second through holes may be electrically connected with the second electronic component.

REFERENCES:
patent: 2007/0263339 (2007-11-01), Sugioka et al.
patent: 2010/0142170 (2010-06-01), Kim et al.
patent: 2010/0277881 (2010-11-01), Russell
patent: 2001-210955 (2001-08-01), None
patent: 2001210955 (2001-08-01), None
patent: 2001210955 (2001-08-01), None
patent: 2006-59852 (2006-03-01), None
patent: 2006-196785 (2006-07-01), None

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