Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-08-27
2011-10-11
Semenenko, Yuriy (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C174S262000
Reexamination Certificate
active
08035978
ABSTRACT:
A printed circuit board includes a mounted a first electronic component. The printed circuit board includes a first through holes extending from a mounting surface on which the electronic component is mounted. The printed circuit board includes a second through holes extending from a surface opposite the mounting surface and aligned with the first through holes. A second electronic component may be longitudinally between the first through holes and the second through holes. The first and second through holes may be electrically connected with the second electronic component.
REFERENCES:
patent: 2007/0263339 (2007-11-01), Sugioka et al.
patent: 2010/0142170 (2010-06-01), Kim et al.
patent: 2010/0277881 (2010-11-01), Russell
patent: 2001-210955 (2001-08-01), None
patent: 2001210955 (2001-08-01), None
patent: 2001210955 (2001-08-01), None
patent: 2006-59852 (2006-03-01), None
patent: 2006-196785 (2006-07-01), None
Fujitsu Limited
Semenenko Yuriy
Staas & Halsey , LLP
LandOfFree
Printed circuit board, fabrication method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Printed circuit board, fabrication method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit board, fabrication method and apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4296913