Printed circuit board fabrication

Details Printed circuit board fabrication Printed circuit board fabrication

1988-07-29

1990-12-25

Ryan, Patrick

Stock material or miscellaneous articles

Structurally defined web or sheet

Including grain, strips, or filamentary elements in...

428137, 428209, 428294, 428901, 361397, 361398, 174255, B32B 302

Patent

active

049802178

ABSTRACT:
The reinforcing fibers in a printed circuit board laminate are arranged in an ordered manner to leave fiber-free zones for the formation of holes. The holes may be oblong to enhance the connection to electrical leads of components mounted on the printed circuit board. The holes may be oriented with their long dimensions transverse to the side of an electrical component, and the electrical component may have its leads correspondingly oriented, to improve wiring flexibility and allow more direct wiring paths.

REFERENCES:
patent: 3258387 (1966-06-01), Brown et al.
patent: 3972765 (1976-08-01), Kondo et al.
patent: 3988408 (1976-10-01), Haining et al.
patent: 4550051 (1985-10-01), Spielau et al.
Jerry Murray, "Today's Substrates," Nov. 1987, Circuit Manufacturing-pp. 25-28.

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