Printed circuit board drill and method of manufacture

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Including a second component containing structurally defined...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

51307, 51309, 428698, 428699, B22F 314, B22F 708

Patent

active

047132868

ABSTRACT:
A composite sintered abrasive drill blank for formation into a rotary cutting tool in which one or more veins of sintered abrasive particulate are positioned to extend longitudinally from the conically shaped point region of the drill blank. The one or more veins of abrasive particulate are directly and molecularly bonded into the drill blank structure to expose the sintered abrasive particulate at both the top conical surface and the circumferential edges of the drill blank, with the sintered abrasive particulate forming the cutting surface elements of the rotary cutting tool formed therefrom.

REFERENCES:
patent: 3136615 (1964-06-01), Bovenkerk et al.
patent: 3141746 (1964-07-01), De Lai
patent: 4359335 (1982-11-01), Garner
patent: 4403015 (1983-09-01), Nakai et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Printed circuit board drill and method of manufacture does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printed circuit board drill and method of manufacture, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit board drill and method of manufacture will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1219556

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.