Printed circuit board defective area transplant repair method

Details Printed circuit board defective area transplant repair method Printed circuit board defective area transplant repair method

2006-12-05

2006-12-05

Chang, Rick Kiltae (Department: 3729)

Metal working

Method of mechanical manufacture

Repairing

C029S402010, C029S402030, C029S402040, C029S402050, C029S402060, C029S402090, C029S402110, C029S402210, C029S830000, C174S250000, C174S255000

Reexamination Certificate

active

07143492

ABSTRACT:
A printed circuit board defective area transplant repair method in which printed circuit boards that are determined to be defective undergo a series of reworking procedures comprised of plotting the printed circuit board area block plan, selecting the printed circuit boards, cutting out the area blocks, cutting the selected area blocks, applying the adhesive and fitting area blocks, adjusting the area block alignment, roller tamping the plastic band, curing the adhesive, and tearing off the plastic band. Following the reworking operations, defective printed circuit boards are restored into a good products capable of continuous use such that printed circuit board fabrication and production is even more economical and environmentally protective and, furthermore, printed circuit board manufacturing reaches maximum utilization rates, thereby effectively increasing practical production value.

REFERENCES:
patent: 3765076 (1973-10-01), Brandt
patent: 6195881 (2001-03-01), Giardina et al.
patent: 7008236 (2006-03-01), Wabiszczewicz
patent: 7017248 (2006-03-01), Choi et al.

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