Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1995-05-17
1997-04-01
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361729, 361752, 361796, 361816, H05K 114, H05K 111
Patent
active
056172966
ABSTRACT:
An electronics package for protective enclosure and connection of the circuit to a system backplane having electromagnetic shielding and enhanced packaging density is provided. The electronics package comprises an enclosure having a first cover and a second cover. Each cover of the enclosure is formed from a multilayer circuit board having an insulating support layer of a selected thickness and of a sufficient rigidity to serve as a protective covering for the electronics package, and a shielding layer formed by a conductive plane of a thickness less than the selected thickness of the insulating support layer. At least one cover of the enclosure is a multilayer circuit board having an electronic circuit formed thereon. The electronics package further comprises a circuit card positioned within the housing and having a connector positioned on the back for mating and connection with the system backplane.
REFERENCES:
patent: 4821145 (1989-04-01), Corfits et al.
patent: 4821146 (1989-04-01), Behrens et al.
patent: 5040994 (1991-08-01), Nakamoto et al.
patent: 5134546 (1992-07-01), Izumi et al.
patent: 5177324 (1993-01-01), Carr et al.
patent: 5329418 (1994-07-01), Tanabe
patent: 5481437 (1996-01-01), Neumann
Hamilton Roger D.
Melville James A.
Dillon Andrew J.
Dinkins Anthony
Gamon Owen J.
International Business Machines - Corporation
Picard Leo P.
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