Printed circuit board comprising elevated bond pads

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

174261, 22818021, 22818022, 257773, 257778, 257779, 361760, 361777, H05K 710

Patent

active

055239200

ABSTRACT:
A printed circuit board (10) comprises a polymeric coating (30) and a metal circuit trace (26) applied to a substrate (22). The coating defines an opening (32) whereat the substrate is uncoated. The metal circuit trace includes a runner section (28) that is covered by the polymeric coating and a bond pad (20) integrally formed to the runner section at the opening and having an upper surface (40) that includes lip (36) overlying the polymer coating to facilitate positioning of a component for solder bonding to the pad. The bond pad preferably also includes a surface accessible within the opening to enhance solder bonding to the bond pad.

REFERENCES:
patent: 3189978 (1965-06-01), Stetson
patent: 3192086 (1965-06-01), Gyurk
patent: 3716907 (1973-02-01), Anderson
patent: 4336551 (1982-06-01), Fujita et al.
patent: 5075965 (1991-12-01), Carey et al.
patent: 5187020 (1993-02-01), Kwon et al.
patent: 5282565 (1994-02-01), Melton
patent: 5291374 (1994-03-01), Hirata et al.
patent: 5311404 (1994-05-01), Trask et al.
patent: 5316788 (1994-05-01), Dibble et al.
patent: 5329068 (1994-07-01), Hirata et al.
patent: 5357060 (1994-10-01), Yamashita
patent: 5383093 (1995-01-01), Nagasaka
patent: 5400221 (1995-03-01), Kawaguchi
patent: 5400950 (1995-03-01), Myers et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Printed circuit board comprising elevated bond pads does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printed circuit board comprising elevated bond pads, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit board comprising elevated bond pads will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-388926

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.