Inductor devices – Windings
Reexamination Certificate
2011-07-05
2011-07-05
Mai, Anh T (Department: 2832)
Inductor devices
Windings
C336S147000, C336S192000, C336S200000, C336S223000, C336S232000
Reexamination Certificate
active
07973635
ABSTRACT:
A multilayer printed circuit board (“PCB”) coil that simulates a coil formed from litz wire. The PCB includes a plurality of alternating conductor and insulating layers interconnected to cooperatively form the coil. Each conductor layer includes a trace that follows the desired coil shape and is divided into a plurality of discrete conductor segments. The segments are electrically connected across layers to provide a plurality of current flow paths (or filaments) that undulate between the layers in a regular, repeating pattern. The coil may be configured so that each filament spends a substantially equal amount of time in proximity to the paired coil and therefore contributes substantially equally to the self or mutual inductance of the coil. Each conductor layer may include a plurality of associated traces and intralayer connector that interconnected so that each filament undulates not only upwardly/downwardly, but also inwardly/outwardly in a regular, repeating pattern.
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Written Opinion and International Search Report, International Filing date Sep. 26, 2008.
Baarman David W.
Duckworth Paul
Guthrie Warren E.
Schwannecke Joshua K.
Wahl Richard A.
Access Business Group International LLC
Lian Mangtin
Mai Anh T
Warner & Norcross & Judd LLP
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