Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-03-07
2010-12-07
Bui, Hung S (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S720000, C361S748000
Reexamination Certificate
active
07848113
ABSTRACT:
According to one embodiment, a printed circuit board is provided with a printed wiring board and a circuit component mounted on the printed wiring board. The printed wiring board includes a first surface on which the circuit component is set, a second surface formed on the reverse side of the first surface, and a through hole formed penetrating the printed wiring board from the first surface to the second surface. The circuit component includes a projected portion to be inserted into the through hole. The projected portion is deformable between a first state in which a distal end of the projected portion projects to the outside of the printed wiring board beyond the second surface and a second state in which the distal end of the projected portion is situated in the through hole.
REFERENCES:
patent: 5395099 (1995-03-01), Hall
patent: 6095823 (2000-08-01), Banks
patent: 6404646 (2002-06-01), Tsai et al.
patent: 6642728 (2003-11-01), Kudo et al.
patent: 6728105 (2004-04-01), Tanaka
patent: 1495969 (2004-05-01), None
patent: 2002-184909 (2002-06-01), None
patent: 2004-14721 (2004-01-01), None
patent: 2005-45110 (2005-02-01), None
Notification of First Office Action with English translation in a corresponding Chinese application dated Jun. 5, 2009, application No. 2008100871539.
Blakely , Sokoloff, Taylor & Zafman LLP
Bui Hung S
Kabushiki Kaisha Toshiba
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