Special receptacle or package – For a building component – Shingle
Patent
1993-06-04
1994-12-27
Price, William I.
Special receptacle or package
For a building component
Shingle
206334, 206509, 217 62, B65D 8542, B65D 4312
Patent
active
053757092
ABSTRACT:
A modular package provides physical protection from shock, crushing and vibration. The modular package is reusable and expandable to fit a variety of sizes of printed circuit boards. In one embodiment, the package has an electrically conductive exterior and provides a faraday shield to protect the printed circuit board from damage by electrical fields.
REFERENCES:
patent: 3182856 (1965-05-01), Goltz
patent: 4293070 (1981-10-01), Ohlbach
patent: 4404615 (1983-09-01), Dep
patent: 4427114 (1984-01-01), Howell et al.
patent: 4553190 (1985-11-01), Mueller
patent: 4557382 (1985-12-01), Johnson
patent: 4561554 (1985-12-01), Swincicki
patent: 4886163 (1989-12-01), Hubbell et al.
patent: 5107989 (1992-04-01), Becker
patent: 5180615 (1993-01-01), Havens
patent: 5244087 (1993-09-01), Hikake et al.
Jay Mark H.
Price William I.
Siemens Medical Systems Inc.
LandOfFree
Printed circuit board carrier and reusable transport packaging does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Printed circuit board carrier and reusable transport packaging, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit board carrier and reusable transport packaging will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-912664