Printed circuit board assembly having adhesive layer

Details Printed circuit board assembly having adhesive layer Printed circuit board assembly having adhesive layer

2007-12-26

2010-06-01

Lam, Cathy (Department: 1794)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S255000, C174S257000, C174S259000, C361S749000, C361S750000, C428S354000, C428S356000

Reexamination Certificate

active

07728232

ABSTRACT:
An exemplary adhesive layer includes an adhesive main body having a first adhesive surface and a second adhesive surface on an opposite side of the adhesive main body to the first adhesive surface. The adhesive main body defines a number of through-holes between the first adhesive surface and the second adhesive surface therein. The through-holes are filled with an inner adhesive that has a higher adhesion than the adhesive main body. Adhesiveness of the first adhesive surface and the second adhesive surface of the adhesive main body can be improved, thereby preventing a printed circuit board having the adhesive layer from distortion.

REFERENCES:
patent: 4209481 (1980-06-01), Kashiro et al.
patent: 5275856 (1994-01-01), Calhoun et al.
patent: 5751068 (1998-05-01), McMahon et al.
patent: 6093476 (2000-07-01), Horiuchi et al.
patent: 6854985 (2005-02-01), Weiss
patent: 6908318 (2005-06-01), Kawate

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