Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-02-26
1997-05-06
Ledynh, Bot L.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361791, 361803, 439591, H05K 111, H01R 1340
Patent
active
056277300
ABSTRACT:
A printed circuit board assembly which includes a two-dimensional array of connectors to provide significantly higher data transfer rates than typical one-dimensional connectors, without sacrificing board space. The assembly preferably includes a plurality of connection pads on each printed circuit board. An anisotropically conducting material is placed between the connection pads and the boards pressed together.
REFERENCES:
patent: 4423435 (1983-12-01), Test, II
patent: 4729809 (1988-03-01), Dery et al.
patent: 4737112 (1988-04-01), Jim et al.
patent: 4770641 (1988-09-01), Rowlette
patent: 4811081 (1989-03-01), Lyden
patent: 4814040 (1989-03-01), Ozawa
patent: 5001302 (1991-03-01), Atsumi
patent: 5041183 (1991-08-01), Nakamura et al.
patent: 5136365 (1992-08-01), Pennisi et al.
patent: 5140405 (1992-08-01), King et al.
patent: 5140657 (1992-08-01), Thylen
patent: 5155302 (1992-10-01), Nguyen
patent: 5174763 (1992-12-01), Wilson
patent: 5174766 (1992-12-01), Yoshizawa et al.
patent: 5183969 (1993-02-01), Odashima
patent: 5193668 (1993-03-01), Fukuchi et al.
patent: 5206585 (1993-04-01), Chang et al.
patent: 5219293 (1993-06-01), Imamura
Baur Peter F.
Konig Walter
Modl Albert
Ledynh Bot L.
Martin Paul W.
NCR Corporation
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