Printed circuit board assembly and method for the manufacture th

Details Printed circuit board assembly and method for the manufacture th Printed circuit board assembly and method for the manufacture th

1983-02-16

1986-02-25

Miska, Vit W.

Electricity: electrical systems and devices

Miscellaneous

29831, H05K 710, H05K 320

Patent

active

045731055

ABSTRACT:
Leadless electronic components are secured to the bottom surface of a printed circuit board in a manner so as to prevent or substantially reduce the displacement of the leadless components prior to or during mass soldering. The technique used to improve the bonding of the leadless components is comprised of a series of steps. Initially, holes are formed through the circuit boards at the positions where it is desired to mount leadless components. A hardenable adhesive is then applied at each of the holes where a leadless component is to be mounted. The amount of adhesive which is applied to each hole is at least sufficient to form a bond with the dielectric body of the leadless component and also to extend partially into the hole formed in the printed circuit board. The leadless components are then brought into contact with the adhesive so as to form an adhesive plug which is bonded to the dielectric body of the leadless component and also to extend into the hole formed in the board. The adhesive is then allowed to harden. The resulting hardened adhesive plug then both mechanically and adhesively holds the leadless components in place through mass soldering of the component to the circuit board.

REFERENCES:
patent: 3390308 (1968-06-01), Marley
patent: 3919602 (1975-11-01), Kaiser et al.
patent: 4139881 (1979-02-01), Shimizu et al.
patent: 4143456 (1979-03-01), Inoue
patent: 4164778 (1979-08-01), Sawairi et al.
patent: 4312692 (1982-01-01), Ikeda et al.
IBM Tech. Discl. Bull., vol. 22, No. 10, 3/80, Coombs et al.
IBM Tech. Discl. Bull., vol. 14, No. 12, 5/72, Goldman.

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