Printed circuit board assembly

Electricity: electrical systems and devices – Miscellaneous

Patent

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Details

29832, 29831, 361407, 361409, H05K 118

Patent

active

047746343

ABSTRACT:
A printed circuit assembly includes surface mounted circuit components held in place on a printed circuit board by a rigid connection. The outwardly extending leads of the circuit component are bonded to conductive areas of the board by an electrically conducting flexible adhesive. The combination of a rigid mechanical connection between the body portion of the circuit component and the board and a flexible, electrically conductive connection between each lead end and the board provides an arrangement capable of withstanding shock loading, as well as vibrational and bending forces to which the assembly might be subjected. The assembly lends itself to relatively inexpensive circuit boards produced by printing techniques, typically including applied metal buses that serve as low resistance shunts to the power connections of the circuit components.

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Wadhwa, S. K., "Low-Cost CKT Pkging", IBM Discl. Bul. vol. 22 No. 2 Jul. 1979 p. 522.
Comerford, L. D., "Flip Chip Bonded Ground Plane for Ceramic Chip Carriers", vol. 24, No. 4, 9/81 pp. 1978-1979.
Bolger, Justin C., Astle, Robert J., Morano, Silvio L. "Conductive Adhesives, Inks, and Coatings", Adhesives for Industry, Jun 24-25 pp. 70-90.

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