Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1994-02-28
1995-07-04
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361789, 361785, 361790, 361791, 361796, 361799, 361803, 439 61, 439 62, 439 65, H01R 2368, H01R 909
Patent
active
054306159
ABSTRACT:
Electronic apparatus comprises a main circuit board, a transition board, and a first connector composed of a first part attached to the main circuit board at one edge thereof and a second part attached to the transition board at a first main face thereof, whereby when the first and second parts are engaged the transition board is substantially perpendicular to the main circuit board. The transition board is attached to a connector board so that the second main face of the transition board is in spaced substantially parallel confronting relationship with a first main face of the connect or board. A second connector is composed of a first part attached to the connector board at its first main face and a second part attached to the transition board at its second main face.
REFERENCES:
patent: 3829741 (1974-08-01), Athey
patent: 4179172 (1979-12-01), Godsey et al.
patent: 4179724 (1979-12-01), Bonhomme
patent: 4251853 (1981-02-01), Sites
patent: 4288838 (1981-09-01), Van Der Vegte et al.
patent: 4511950 (1985-04-01), Bunner et al.
patent: 4573753 (1986-03-01), Vogl
patent: 4631641 (1986-12-01), Brombal et al.
patent: 4703394 (1987-10-01), Petit et al.
patent: 4821145 (1989-04-01), Corfits et al.
patent: 4893405 (1990-01-01), Pennington
patent: 4900948 (1990-02-01), Hamilton
patent: 4949171 (1990-08-01), Grandmougin
patent: 5030108 (1991-07-01), Babow et al.
AT&T Technical Digest "Circuit Pack Adaptor For High-Speed Circuit Packs" by Eminger No. 73 1/84.
IBM Technical Disclosure Bulletin "Field Replaceable Engineering Change Package" by J. Kresge vol. 18 No. 12 5/76.
IBM Technical Disclosure Bulletin "Interposers For Power and Signal Transmission" by Aug et al. vol. 20 No. 10 3/78.
Bryars Ray
Deering Michael
Keeth Brent
VanDusen Charles
Gray Francis I.
Picard Leo P.
Smith-Hill John
Sparks Donald A.
The Grass Valley Group Inc.
LandOfFree
Printed circuit board assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Printed circuit board assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit board assembly will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-765089