Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2010-03-22
2011-12-06
Hoffberg, Robert J (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S679470, C361S679520, C361S679540, C361S700000, C361S704000, C361S709000, C165S080300, C165S185000, C174S015200, C174S016300
Reexamination Certificate
active
08072763
ABSTRACT:
A printed circuit board assembly includes a heat sink, a back board, and a securing member. The heat sink is configured to be mounted on a heat generating element of a printed circuit board. The heat sink is configured to dissipate heat generated by the heat generating element. The heat sink and the back board are configured to be placed on opposite sides of the printed circuit board. The heat sink includes a first connecting heat pipe. The back board includes a second connecting heat pipe. The second connecting heat pipe contacts the first connecting heat pipe. The securing member thermally contacts the first connecting heat pipe and the second connecting heat pipe.
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Fu Shuang
Li Yang
Sun Hong-Zhi
Altis Law Group, Inc.
Hoffberg Robert J
Hon Hai Precision Industry Co. Ltd.
Hong Fu Jin Precision Industry ( ShenZhen) Co., Ltd.
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