Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2010-01-28
2011-12-06
Hoffberg, Robert J (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S679470, C361S679480, C361S679520, C361S679540, C361S695000, C361S697000, C361S700000, C361S704000, C361S709000, C361S710000, C165S080300, C165S185000, C174S015200, C174S016100, C174S016300
Reexamination Certificate
active
08072762
ABSTRACT:
A printed circuit board assembly includes a printed circuit board, a first heat dissipating module, and a second heat dissipating module. The printed circuit board includes a first heat generating element and a second heat generating element. The first heat dissipating module is disposed on the first heat generating element. The first heat dissipating module includes a heat sink and a first heat pipe. The first heat pipe includes a pipe body and an extending portion extending from the pipe body. The second heat dissipating module is disposed on the second heat generating element. The pipe body is connected to the heat sink and the extending portion is connected to the second heat dissipating module.
REFERENCES:
patent: 7295437 (2007-11-01), Lee et al.
patent: 7520316 (2009-04-01), Xia et al.
patent: 7532476 (2009-05-01), Sauciuc
patent: 7694727 (2010-04-01), Yang et al.
patent: 7697293 (2010-04-01), Peng et al.
patent: 7753109 (2010-07-01), Min et al.
patent: 7755894 (2010-07-01), Yang et al.
patent: 7782617 (2010-08-01), Li et al.
patent: 2003/0183373 (2003-10-01), Sarraf et al.
patent: 2007/0263357 (2007-11-01), Ju
patent: 2007/0268670 (2007-11-01), Chu et al.
patent: 2009/0223647 (2009-09-01), Alousi et al.
patent: 2009/0321054 (2009-12-01), Qin et al.
patent: 2010/0002391 (2010-01-01), Jiang et al.
patent: 03074864 (1991-03-01), None
patent: 08222672 (1996-08-01), None
Fu Shuang
Li Yang
Altis Law Group, Inc.
Hoffberg Robert J
Hon Hai Precision Industry Co. Ltd.
Hong Fu Jin Precision Industry ( ShenZhen) Co., Ltd.
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