Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-01-03
2006-01-03
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C361S760000, C257S712000, C174S252000, C165S080300, C165S185000
Reexamination Certificate
active
06982876
ABSTRACT:
A PCB assembly (1) in this case a DC-DC converter comprising a single layer board (2), mounts power semi-conductor devices forming high heat generating components (3) and various cores of magnetic material forming heat dissipating components (4). Tracks of heat conductive coupling material (6) lie above or below each heat generating component (3) and project into one of the heat dissipating components (4) and beside the others. In one embodiment, the heat generating components (3) are housed within a heat dissipating component (3). In another PCB assembly, there is an additional plug-in PCB which may itself carry heat generating components (3) or only heat dissipating components (4). In the latter case, the heat generating components (3) are mounted on the PCB assembly below the additional plug-in PCB.
REFERENCES:
patent: 4712160 (1987-12-01), Sato et al.
patent: 4803590 (1989-02-01), Fassel et al.
patent: 5019941 (1991-05-01), Craft
patent: 5079672 (1992-01-01), Haubner et al.
patent: 5384683 (1995-01-01), Tsunoda
patent: 5734555 (1998-03-01), McMahon
patent: 5926944 (1999-07-01), Smith et al.
patent: 5973923 (1999-10-01), Jitaru
patent: 6005773 (1999-12-01), Rozman et al.
patent: 6091604 (2000-07-01), Plougsgaard et al.
patent: 6222733 (2001-04-01), Gammenthaler
patent: 6459586 (2002-10-01), Miller et al.
patent: 197 07 702 (1998-08-01), None
patent: 0 413 848 (1991-02-01), None
patent: 0 531 687 (1993-03-01), None
patent: 0 856 447 (1998-08-01), None
patent: 0 896 419 (1999-02-01), None
Patent Abstract of Japan vol. 1995, No. 03, (Apr. 25, 1995).
Patent Abstract of Japan vol. 1998, No. 11, Sep. 30, 1998.
Patent Abstract of Japan vol. 7, No. 111 (E-175), May 14, 1983.
Patent Abstracts of Japan vol. 1997, No. 2, Feb. 28, 1997.
Patent Abstracts of Japan vol. 1996, No. 3, Mar. 29, 1996.
Chervinsky Boris
Commergy Technologies Limited
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