Printed circuit board and soldering method and apparatus

Details Printed circuit board and soldering method and apparatus Printed circuit board and soldering method and apparatus

2006-07-28

2009-06-30

Patel, Ishwar (I. B.) (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000

Reexamination Certificate

active

07554040

ABSTRACT:
A printed circuit board suitable for dip soldering of component leads in through holes using lead free solder. The printed circuit board includes a plurality of via holes arranged around each through hole in which a component lead is inserted, whereby solder wicking up into the through hole is enhanced and air entrapment is prevented during the dip soldering operation, and heat fatigue resistance of solder joints is improved.

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patent: 6657135 (2003-12-01), Suetsugu et al.
patent: 2004/0108130 (2004-06-01), Suzuki et al.
patent: H05-72176 (1991-03-01), None
patent: 9-148691 (1997-06-01), None
patent: 103222025 (1998-12-01), None

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