Printed circuit board and method using thermal spray techniques

Details Printed circuit board and method using thermal spray techniques Printed circuit board and method using thermal spray techniques

1988-08-09

1990-07-10

Silverman, Stanley

Stock material or miscellaneous articles

Structurally defined web or sheet

Including variation in thickness

427 531, 427 96, 427275, 427307, 427422, 427423, 428901, B05B 500, B05D 306

Patent

active

049406230

ABSTRACT:
A method of making printed circuit boards, particularly 3-Dimensional circuit boards, wherein a surface layer of micron sized hollow spheres, beads or spacers are ruptured or fractured in a pattern defining the electrical circuit. The circuit pattern is thermally sprayed with molten copper particles. The molten copper particles shape themselves to the nooks, crannies and undercuts of the fractured spheres or beads to mechanically lock the electrical circuitry to the board. The current carrying capacity can be adjusted by the thickness of the sprayed metal. The overspray does not adhere to smooth non porous surfaces adjacent the fractured spheres or beads.

REFERENCES:
patent: 4508754 (1985-04-01), Stepan
patent: 4532152 (1985-07-01), Elarde
patent: 4643798 (1987-02-01), Takada et al.
patent: 4781968 (1988-11-01), Kellerman

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