Printed circuit board and method of manufacturing the same

Details Printed circuit board and method of manufacturing the same Printed circuit board and method of manufacturing the same

2009-06-16

2011-11-01

Semenenko, Yuriy (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S257000

Reexamination Certificate

active

08049111

ABSTRACT:
A first insulating layer is formed on a suspension body. Wiring traces are formed in parallel at an interval on the first insulating layer. A second insulating layer is formed in a region on the first insulating layer on both sides of the wiring traces. A wiring trace is formed in a region on the second insulating layer on the side of the wiring trace. A wiring trace is formed in a region on the second insulating layer on the side of the wiring trace. A third insulating layer is formed on the first and second insulating layers to cover the wiring traces.

REFERENCES:
patent: 5717547 (1998-02-01), Young
patent: 5995328 (1999-11-01), Balakrishnan
patent: 6894874 (2005-05-01), Maruyama et al.
patent: 6900967 (2005-05-01), Coon et al.
patent: 7142395 (2006-11-01), Swanson et al.
patent: 2008/0000673 (2008-01-01), Ishii et al.
patent: 2010/0000774 (2010-01-01), Naito et al.
patent: 2006-042098 (2006-02-01), None

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