Printed circuit board and method of manufacturing the same

Details Printed circuit board and method of manufacturing the same Printed circuit board and method of manufacturing the same

2009-01-23

2011-12-20

Semenenko, Yuriy (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S761000

Reexamination Certificate

active

08080740

ABSTRACT:
A first insulating layer is formed on a suspension body, and a write wiring trace is formed on the first insulating layer. A second insulating layer is formed on the first insulating layer so as to cover the wiring trace. A ground layer is formed on the second insulating layer so as to be positioned above the wiring trace. Moreover, a third insulating layer is formed on the second insulating layer so as to cover the ground layer. A read wiring trace is formed on the third insulating layer. A fourth insulating layer is formed on the third insulating layer so as to cover the wiring trace.

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CN Office Action issued Jul. 26, 2011 from the Patent Office of the People's Republic of China in counterpart CN Application No. 200910000493.8. (English translation attached).

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