Printed circuit board and method of manufacturing the same

Details Printed circuit board and method of manufacturing the same Printed circuit board and method of manufacturing the same

2006-10-24

2009-10-13

Lam, Cathy (Department: 1794)

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

C174S257000, C174S258000, C174S259000, C361S750000, C361S751000

Reexamination Certificate

active

07601419

ABSTRACT:
Disclosed are a printed circuit board and a method of manufacturing the same, in which a fluorine resin coating layer is formed on a resin substrate, and then a copper layer is formed using a dry process including ion beam surface treatment and vacuum deposition instead of a conventional wet process including surface roughening and electroless copper plating. According to this invention, the interfacial adhesion of the substrate material may be increased without changing the surface roughness thereof, thus realizing a highly reliable fine circuit. As well, a low dielectric constant and a low loss coefficient may be obtained thanks to the formation of the fluorine resin layer. Further, a wet process is replaced with a dry process, whereby the copper plating layer may be formed in an environmentally friendly manner.

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Korean Intellectual Property Office—Office Action dated May 15, 2007 and issued in corresponding Korean Patent Application No. 10-2006-0063770.
Japanese Office Action issued on Apr. 14, 2009 in corresponding Japanese Patent Application 2006-340387.

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