Printed circuit board and method for manufacturing the same

Details Printed circuit board and method for manufacturing the same Printed circuit board and method for manufacturing the same

2006-10-31

2010-10-05

Bui, Hung S (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S260000, C174S261000, C361S774000, C361S777000, C361S788000, C361S789000

Reexamination Certificate

active

07807932

ABSTRACT:
An embodiment of a printed circuit board according to the present invention is provided with an insulating layer, a conductive layer that is laminated on the insulating layer and that has a connecting portion and a circuit pattern portion formed connected to the connecting portion, and a film cover layer that covers the insulating layer and the conductive layer via an adhesive layer and that has an opening for connecting a mounted component to the connecting portion. The circuit pattern portion is provided with a recessed portion that is concave with respect to the connecting portion.

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