Printed circuit board and method for manufacturing same

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Reexamination Certificate

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08067696

ABSTRACT:
A printed circuit board includes an insulating layer, a copper layer formed on the insulating layer and a reinforcing layer formed on the copper layer at opposite sides of the given portion. The copper layer includes a plurality of electrical traces at a given portion thereof. A thickness of the reinforcing layer increases in a direction away from the given portion. A method for manufacturing the printed circuit board is also provided in this disclosure.

REFERENCES:
patent: 6252176 (2001-06-01), Kuramochi et al.
patent: 2006/0071345 (2006-04-01), Chiu et al.

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