Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2009-04-23
2011-12-27
Dinh, Phuong (Department: 2839)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
Reexamination Certificate
active
08084696
ABSTRACT:
A printed circuit board and a method of manufacturing the same are disclosed. The method of manufacturing a printed circuit board including a connecting layer configured to which is configured to electrically connect both sides of an insulator, and a pad part, electrically connect both sides of an insulator, and a pad part formed in one side of the insulator to be directly in contact with the connecting layer, includes: forming a seed layer part on one side of the insulator, a portion of the seed layer part being bulged, forming a via hole by processing the other side of the insulator, corresponding to the bulged portion of the seed layer part, forming the connecting layer inside the via hole, and forming a plating layer, corresponding to the pad part, on the seed layer part. A pattern having a finer pitch, maintaining a VOP structure, can be formed and a lower side of a substrate is not penetrated through when a via hole is processed.
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Kim Tae-Gui
Lee Jae-Soo
Lee Tae-Gon
Shin Young-Hwan
Dinh Phuong
McDermott Will & Emery LLP
Samsung Electro-Mechanics Co. Ltd.
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