Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2008-12-10
2011-11-15
Banks, Derris (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S830000, C029S831000, C029S832000, C029S846000, C029S852000, C385S014000
Reexamination Certificate
active
08056220
ABSTRACT:
A printed circuit board is disclosed. A printed circuit board, which includes a first board part, a flexible board part which has one side coupled with the first board part and which includes an electrical wiring layer and an optical waveguide to transmit both electrical signals and optical signals, and a second board part coupled with the other side of the flexible board part, where the electrical wiring layer and the optical waveguide are disposed with a gap in-between, can provide greater bendability and reliability, by having the optical waveguide and electrical wiring layer separated with a gap in-between at the flexible portion of the board, and the optical waveguide can be manufactured with greater precision for even higher reliability, by having the optical waveguide manufactured separately and then inserted during the manufacturing process of the board.
REFERENCES:
patent: 5054870 (1991-10-01), Lösch et al.
patent: 5125054 (1992-06-01), Ackley et al.
patent: 5737458 (1998-04-01), Wojnarowski et al.
patent: 5761350 (1998-06-01), Koh
patent: 5994975 (1999-11-01), Allen et al.
patent: 6763164 (2004-07-01), Kashihara et al.
patent: 7348786 (2008-03-01), Thacker et al.
patent: 2004/0190831 (2004-09-01), Lu et al.
patent: 2007/0183718 (2007-08-01), Bae et al.
patent: 2003-227951 (2003-08-01), None
patent: 2006-140233 (2006-06-01), None
patent: 2006-243467 (2006-09-01), None
U.S. Office Action mailed Dec. 22, 2010 in related U.S. Appl. No. 12/314,449.
U.S. Appl. No. 11/984,114, filed Nov. 13, 2007, Sang-Hoon Kim, Samsung Electro-Mechanics Co., Ltd.
U.S. Appl. No. 12/314,449, filed Dec. 10, 2008, Sang-Hoon Kim, Samsung Electro-Mechanics Co., Ltd.
Japanese Office Action dated Jun. 22, 2010 and issued in corresponding Japanese Patent Application 2007-291164.
U.S. Notice of Allowance mailed Oct. 8, 2008 in related U.S. Appl. No. 11/984,114.
U.S. Requirement for Restriction mailed Jul. 10, 2008 in related U.S. Appl. No. 11/984,114.
Japanese Office Action dated Oct. 26, 2010 and issued in corresponding Japanese Patent Application 2007-291164.
U.S. Patent Office Action mailed May 16, 2011 in co-pending U.S. Appl. No. 12/314,449.
Cho Han Seo
Kim Joon-Sung
Kim Sang-Hoon
Yoo Je-Gwang
Banks Derris
Nguyen Tai
Samsung Electro-Mechanics Co. Ltd.
LandOfFree
Printed circuit board and manufacturing method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Printed circuit board and manufacturing method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed circuit board and manufacturing method thereof will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4284353