Printed circuit board and manufacturing method thereof

Details Printed circuit board and manufacturing method thereof Printed circuit board and manufacturing method thereof

2007-11-13

2011-11-15

Estrada, Angel R (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S748000, C029S846000

Reexamination Certificate

active

08058558

ABSTRACT:
A printed circuit board and a manufacturing method thereof are disclosed. Using a method of manufacturing a printed circuit board which includes forming a circuit pattern, which includes lands, on a first board; forming a paste bump on the land of the first board; and stacking an insulation on a surface of the first board such that the paste bump penetrates the insulation, where the paste bump is formed to cover the land of the first board, the areas of the lands can be reduced to manufacture a printed circuit board of high density, and the contact reliability can be increased due to the increase in contact area between the lands and paste bumps to improve the performance of the high-density printed circuit-board.

REFERENCES:
patent: 7045198 (2006-05-01), Nakagiri et al.
patent: 7312400 (2007-12-01), Ito et al.
patent: 7320173 (2008-01-01), Lee et al.
patent: 2008/0053688 (2008-03-01), Park et al.
patent: 2008/0264676 (2008-10-01), Okabe et al.
patent: 10-93242 (1998-04-01), None
patent: 10-303561 (1998-11-01), None
patent: 2005-167094 (2005-06-01), None
patent: 2006-147748 (2006-06-01), None
patent: 2005-0063689 (2005-06-01), None
Japanese Office Action issued Sep. 14, 2010 in corresponding Japanese Patent Application 2007-274375.
Japanese Office Action issued Dec. 11, 2009 in corresponding Japanese Patent Application 2007-209405.

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