Printed circuit board and manufacturing method thereof

Details Printed circuit board and manufacturing method thereof Printed circuit board and manufacturing method thereof

2008-01-07

2010-02-23

Banks, Derris H (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S831000, C029S834000, C029S847000, C174S264000, C174S255000, C361S748000, C361S310000, C361S736000, C361S792000

Reexamination Certificate

active

07665206

ABSTRACT:
A printed circuit board and a method of manufacturing a printed circuit board are disclosed. Using a method of manufacturing a printed circuit board, which includes: forming a multilayer board by alternately stacking circuit pattern layers and insulation layers such that a predetermined thickness of a partial area has only insulation layers stacked therein; and removing insulation layers from the partial area of the multilayer board, a printed circuit board can be manufactured that is suitable for a slim module.

REFERENCES:
patent: 4800461 (1989-01-01), Dixon et al.
patent: 6324067 (2001-11-01), Nishiyama
patent: 2002/0032961 (2002-03-01), Matsuda
patent: 2006/0003495 (2006-01-01), Sunohara et al.
patent: 1761378 (2006-04-01), None
patent: 10-2006-0048664 (2006-05-01), None
Korean Patent Office Action, mailed Aug. 26, 2008 and issued in corresponding Korean Patent Application No. 10-2007-0041536.

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