Printed circuit board and manufacturing method thereof

Details Printed circuit board and manufacturing method thereof Printed circuit board and manufacturing method thereof

2008-07-16

2010-10-05

Pak, Sung H (Department: 2874)

Optical waveguides

Integrated optical circuit

C385S129000

Reexamination Certificate

active

07809220

ABSTRACT:
A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The printed circuit board can include: an optical waveguide, in one side of which a circuit pattern and a pad are buried; an insulation layer stacked over one side of the optical waveguide; a first insulating material stacked over the insulation layer; a first electrical wiring layer stacked over the first insulating material; a second insulating material stacked over the other side of the optical waveguide; a second electrical wiring layer stacked over the second insulating material; and a via penetrating the optical waveguide. Certain embodiments of the invention enable the efficient transmission of optical and electrical signals, reduce loss in the optical signals transferred to the photoelectric converters, and allow more efficient designs for the wiring in the board.

REFERENCES:
patent: 2004/0218848 (2004-11-01), Shen et al.
patent: 2004/0264837 (2004-12-01), Ogawa
patent: 2007/0086696 (2007-04-01), Hsu
patent: 2007/0104413 (2007-05-01), Hsu
patent: 2008/0107375 (2008-05-01), Yonekura et al.
patent: 2009/0028497 (2009-01-01), Kodama et al.
patent: 10-0796982 (2008-01-01), None
Korean Office Action issued Oct. 21, 2009 in corresponding Korean Patent Applicatiion 10-2008-0014961.

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