Printed circuit board and manufacturing method thereof

Details Printed circuit board and manufacturing method thereof Printed circuit board and manufacturing method thereof

2007-03-21

2008-05-20

Norris, Jeremy C. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S250000, C174S254000, C174S261000, C428S209000, C428S210000, C439S260000, C361S792000, C361S793000, C361S794000, C361S795000

Reexamination Certificate

active

07375286

ABSTRACT:
A plurality of wiring patterns in a stripe form are formed to be parallel to one another on one surface of a base insulating layer. The wiring patterns each have a layered structure including a conductive layer and a wiring layer. A thin metal film is formed on the other surface of the base insulating layer, and a plurality of ground patterns in a stripe form are formed to be parallel to one another on the thin metal film. The wiring patterns and the ground patterns are provided in a staggered manner so that they are not opposed to one another with the base insulating layer interposed therebetween. In other words, the ground patterns are provided to be opposed to regions between the wiring patterns.

REFERENCES:
patent: 5322974 (1994-06-01), Walston
patent: 5420553 (1995-05-01), Sakamoto et al.
patent: 5608192 (1997-03-01), Moriizumi et al.
patent: 6040936 (2000-03-01), Kim et al.
patent: 7004775 (2006-02-01), Sakurai et al.
patent: 2004/0227669 (2004-11-01), Okado
patent: 2004/0232415 (2004-11-01), Aoki et al.
patent: 2005/0001331 (2005-01-01), Kojima et al.
patent: 2006/0068173 (2006-03-01), Kajiyama et al.
patent: 2006/0141764 (2006-06-01), Oi et al.
patent: 2001339159 (2001-12-01), None
patent: 2004-88020 (2004-03-01), None

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