Printed circuit board and manufacturing method thereof

Details Printed circuit board and manufacturing method thereof Printed circuit board and manufacturing method thereof

2007-06-12

2007-06-12

Thomas, Eric W. (Department: 2831)

Electricity: electrical systems and devices

Electrolytic systems or devices

Solid electrolytic capacitor

C361S532000, C361S763000

Reexamination Certificate

active

11086596

ABSTRACT:
A printed circuit board which is thin and incorporates a large-capacitance capacitor function and a manufacturing method thereof. In one embodiment, the printed circuit board manufacturing method includes forming inner layer conductor circuits on a core substrate; forming a recess part on the core substrate; housing, in a recess part, a planar capacitor device that is not resin molded and has electrodes on the surfaces on a shared side; interposing the same between insulator resin and conductor metal foil to heat pressurize the same for forming a multi-layer plate; forming via holes for electrically connecting an outer layer conductor circuit to the electrodes of the capacitor device; forming a conductor layer on them; and forming the outer layer conductor circuits on the surfaces of the multi-layer plate.

REFERENCES:
patent: 3895272 (1975-07-01), Smolko et al.
patent: 6707662 (2004-03-01), Waffenschmidt et al.
patent: 0899992 (1999-03-01), None
patent: 06-069663 (1994-03-01), None
patent: 2001168534 (2001-06-01), None
patent: 2002-100875 (2002-04-01), None
patent: 2002100875 (2002-04-01), None

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