Printed circuit board and forming method thereof

Details Printed circuit board and forming method thereof Printed circuit board and forming method thereof

2005-10-20

2009-11-10

Patel, Ishwar (I.B.) (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000, C029S832000

Reexamination Certificate

active

07615707

ABSTRACT:
A printed circuit board and a forming method for forming the printed circuit board are disclosed. The printed circuit board includes a substrate and a conductive layer. The substrate includes a through hole, wherein one side of the through hole of the substrate corresponds to a first diameter, and the other side of the through hole of the substrate corresponds to a second diameter. The second diameter is greater than the first diameter. The conductive layer is placed on the inner surface of the through hole for electrically connecting the two sides of the substrate.

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